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designers are experienced with a variety of current technologies. As
technology changes, we must also stay current with these changes. We do
not profess to know all, we ask questions, and we can follow
customer-supplied specifications. We learn from these projects and apply
this knowledge toward the next design. A list of technologies we have
specific experience follows;
Packaging
High density 2-Sided SMT
High density mixed SMT and thru hole
Multilayer Boards (1 to 24 layers)
Blind and buried vias
Ball grid array and Micro BGA’s
Design for Manufacturing
Design for Testability
Technologies
High speed digital
Mixed analog and digital
Fibre-Channel
LVD (Low Voltage Differential)
RF (Radio Frequencies)
Controlled Lengths, Impedance, Crosstalk
Matched Line Lengths
Differential (balanced) Pairs
Ground Shielded Nets
Network connectivity up to Oc48
EMC Considerations
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